1993 International Symposium on Microelectronics: Proceedings : 9-11 November, 1993, Dallas Convention Center, Dallas, TexasThe Society, 1993 - 719 pagine |
Sommario
20 | 4 |
3D Green Tape Planar Langmuir Sensor Structures | 20 |
A Pressure Sensor Comprised of Diamond J L Davidson | 26 |
Copyright | |
57 sezioni non visualizzate
Parole e frasi comuni
alumina anorthite applications assembly bump capacitance capacitor carrier ceramic charge amplifier chip circuit cleaning coating cofired components conductive adhesives conductor copper crack crosstalk CVDD density deposition developed diameter diamond films dielectric dielectric constant effect electronic etching fabrication factor firing flip chip flux residue gahnite glass Green Tape heat hybrid increase interconnect interface JFET laminate laser layer LTCC manufacturing material MCM-D measured mechanical metal load method Microelectronics microns MLC connector multilayer oxide package pads parameters particles Parylene paste rheology pattern performance photoresist pitch plasma plating polyimide polymer powder printed probe Proc properties reflow reliability resistor samples sensor shown in Figure shows shrinkage silicon silver sintering solder balls solder joint solder paste strain stress structure substrate Table tack techniques temperature thermal conductivity thermal cycling thick film thin film through-hole typical values wire bond