Fundamentals of Electrochemical DepositionJohn Wiley & Sons, 11 ago 2006 - 392 pagine Excellent teaching and resource material . . . it is concise, coherently structured, and easy to read . . . highly recommended for students, engineers, and researchers in all related fields." -Corrosion on the First Edition of Fundamentals of Electrochemical Deposition From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition plays a crucial role in an array of key industries. Fundamentals of Electrochemical Deposition, Second Edition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. The most authoritative introduction to the field so far, the book presents detailed coverage of the full range of electrochemical deposition processes and technologies, including: * Metal-solution interphase * Charge transfer across an interphase * Formation of an equilibrium electrode potential * Nucleation and growth of thin films * Kinetics and mechanisms of electrodeposition * Electroless deposition * In situ characterization of deposition processes * Structure and properties of deposits * Multilayered and composite thin films * Interdiffusion in thin film * Applications in the semiconductor industry and the field of medicine This new edition updates the prior edition to address the new developments in the science and its applications, with new chapters on innovative applications of electrochemical deposition in semiconductor technology, magnetism and microelectronics, and medical instrumentation. Added coverage includes such topics as binding energy, nanoclusters, atomic force, and scanning tunneling microscopy.Example problems at the end of chapters and other features clarify and improve understanding of the material. Written by an author team with extensive experience in both industry and academe, this reference and text provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology. |
Sommario
1 | |
7 | |
3 Metals and Metal Surfaces | 25 |
4 MetalSolution Interphase | 41 |
5 Equilibrium Electrode Potential | 55 |
6 Kinetics and Mechanism of Electrodeposition | 77 |
7 Nucleation and Growth Models | 113 |
8 Electroless Deposition | 139 |
13 Characterization of Metallic Surfaces and Thin Films | 221 |
14 In Situ Characterization of Deposition | 237 |
15 Mathematical Modeling in Electrochemistry | 249 |
16 Structure and Properties of Deposits | 273 |
17 Electrodeposited Multilayers | 289 |
18 Interdiffusion in Thin Films | 307 |
19 Applications in Semiconductor Technology | 321 |
20 Applications in the Fields of Magnetism and Microelectronics | 333 |
Altre edizioni - Visualizza tutto
Fundamentals of Electrochemical Deposition Milan Paunovic,Mordechay Schlesinger Anteprima non disponibile - 2006 |
Fundamentals of Electrochemical Deposition Milan Paunovic,Mordechay Schlesinger Anteprima non disponibile - 2006 |
Parole e frasi comuni
activity activity coefficient additives adsorbed adsorption alloy anodic atoms Bockris bulk Calculate cathode cell Chapter charge Chem chemical coefficient concentration constant copper corrosion coumarin crystal crystallites current density current–potential curves determined dielectric dielectric constant diffusion discussed displacement deposition double layer effect elec electric electrochemical deposition Electrochemical Society Electrochemistry electrode reaction electrodeposition electroless deposition electrolyte Electroplating energy equation equilibrium example formation function Fundamentals of Electrochemical galvanostatic grain growth hydrogen increase interaction interface interphase ionic ions kinetic lattice magnetic mechanism metal deposition metal ion method Milan Paunovic mixed potential molecules Mordechay Schlesinger multilayer nickel nitinol nucleation nuclei orbitals orientation overpotential oxidation partial reactions permission Phys physisorption plane plating potentiostatic produced properties result shown in Figure solution specific standard electrode potential stent step structure substrate surface techniques temperature theory thickness thin films tion values Wiley x-ray York
Riferimenti a questo libro
Chemical Physics of Thin Film Deposition Processes for Micro- and Nano ... Y. Pauleau Anteprima limitata - 2002 |
Electrical Contacts: Fundamentals, Applications and Technology Milenko Braunovic,Nikolai K. Myshkin,Valery V. Konchits Anteprima non disponibile - 2017 |