Fundamentals of Electrochemical DepositionWiley, 1998 - 301 pagine It would be difficult to overstate the importance of electrochemical deposition to science and technology in the late twentieth century. If not for modern electrochemical deposition methods developed over the past decade and a half, many of today's technological wonders simply would never have been. From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition now plays a crucial role in an array of key industries. And, if the recent shift from physical to electrochemical techniques in microcircuit manufacturing is any indication, its importance will only continue to grow in the years ahead. This book offers a wide-ranging, authoritative look at state-of-the-art electrochemical deposition theory and practice. Written by an author team with extensive experience in both industry and academe, it provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology. Over the course of 18 independent chapters, Drs. Paunovic and Schlesinger present detailed coverage of the full range of electrochemical deposition processes and technologies, including: * Metal-solution interphase * Charge transfer across an interphase * Formation of an equilibrium electrode potential * Nucleation and growth of thin films * Kinetics and mechanisms of electrodeposition * Electroless deposition * In situ characterization of deposition processes * Structure and properties of deposits * Multilayered and composite thin films * Interdiffusion in thin film. Fundamentals of Electrochemical Deposition is an ideal graduate-level textbook for students of electrochemistry and related areas. It is also an indispensable working resource for all professionals who use this technology, including platers and metal finishers. Fundamentals of Electrochemical Deposition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. With the help of examples drawn from a wide range of areas, the authors describe the science and technology behind all electrodeposition methods currently used in industry. Emphasizing the practical concerns of professionals who use this technology, they provide detailed coverage of: * nIonic solutions, metal surfaces, and metal-solution interphases * Electrode potential, deposition kinetics, and thin film nucleation * Electroless and displacement type depositions * Effects of additives and the science and technology of alloy deposition * Current distribution during deposition * In situ and ex situ deposit characterization * Mathematical modeling in electrochemistry * Structure, properties of deposits, multilayers, and interdiffusion. |
Sommario
An Overview | 1 |
Water and Ionic Solutions | 7 |
Metals and Metal Surfaces | 23 |
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Fundamentals of Electrochemical Deposition Milan Paunovic,Mordechay Schlesinger Visualizzazione estratti - 1998 |
Parole e frasi comuni
activity adsorbed adsorption alloy anodic atoms bath Bockris bond bulk cathode cell Chapter Chem chemical coefficient complex concentration copper coumarin crystal crystallites Cu2+ current density dielectric constant diffusion discuss displacement deposition double layer elec electric electrochemical cell electrochemical deposition electrochemical reaction Electrochemical Society Electrochemistry electrode potential electrode reaction electrodeposition electroless deposition electrolyte energy epitaxial equation equilibrium example formation function FURTHER READING galvanostatic grain H₂O hydrated hydrogen interaction interface interphase ionic kinetic lattice leveling mA/cm² magnetic mechanism metal deposition metal ions metal-solution method mixed potential mixed-potential theory multilayer nickel nucleation nuclei orbitals orientation overpotential oxidation partial reactions Paunovic permission physisorption plane plating potentiostatic produce properties reference electrode REFERENCES AND FURTHER result Section shown in Figure solution species standard electrode potential step structure substrate surface techniques temperature theoretical thickness tion types values York
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Chemical Physics of Thin Film Deposition Processes for Micro- and Nano ... Y. Pauleau Anteprima limitata - 2002 |
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